ug18ct, ugf18ct, ugb18ct series vishay semiconductors formerly general semiconductor document number 88759 www.vishay.com 30-jul-02 1 dual ultrafast plastic rectifiers reverse voltage 50 to 200v forward current 18a reverse recovery time 20ns 0.08 (2.032) 0.24 (6.096) 0.42 (10.66) 0.63 (17.02) 0.12 (3.05) 0.33 (8.38) mounting pad layout to-263ab dimensions in inches and (millimeters) 0.380 (9.65) 0.411 (10.45) 0.320 (8.13) 0.360 (9.14) 0.591(15.00) 0.624 (15.85) 1 2 0.245 (6.22) min k k pin 1 pin 2 k - heatsink 0.160 (4.06) 0.190 (4.83) 0.045 (1.14) 0.055 (1.40) 0.015 (0.38) 0.022 (0.56) 0.110 (2.79) 0.140 (3.56) 0.021 (0.53) 0.014 (0.36) 0.047 (1.19) 0.055 (1.40) 0-0.01 (0-0.254) 0.027 (0.686) 0.037 (0.940) 0.105 (2.67) 0.095 (2.41) 0.205 (5.20) 0.195 (4.95) 1 3 pin 2 0.060 (1.52) 0.405 (10.27) 0.383 (9.72) 0.191 (4.85) 0.171 (4.35) 0.600 (15.5) 0.580 (14.5) 0.560 (14.22) 0.530 (13.46) 0.037 (0.94) 0.027 (0.69) 0.140 (3.56) 0.130 (3.30) 0.350 (8.89) 0.330 (8.38) 0.188 (4.77) 0.172 (4.36) 0.110 (2.80) 0.100 (2.54) 0.131 (3.39) 0.122 (3.08) 0.110 (2.80) 0.100 (2.54) 0.022 (0.55) 0.014 (0.36) dia. dia. 0.676 (17.2) 0.646 (16.4) 0.205 (5.20) 0.195 (4.95) 0.105 (2.67) 0.095 (2.41) pin 2 pin 1 pin 3 ito-220ab (ugf18ct series) to-220ab (ug18ct series) to-263ab (ugb18ct series) 123 pin 0.185 (4.70) 0.175 (4.44) 0.055 (1.39) 0.045 (1.14) 0.145 (3.68) 0.135 (3.43) 0.350 (8.89) 0.330 (8.38) 0.560 (14.22) 0.530 (13.46) 0.022 (0.56) 0.014 (0.36) 0.110 (2.79) 0.100 (2.54) 0.603 (15.32) 0.573 (14.55) case 1.148 (29.16) 1.118 (28.40) pin 2 0.154 (3.91) 0.148 (3.74) 0.113 (2.87) 0.103 (2.62) 0.160 (4.06) 0.140 (3.56) 0.410 (10.41) 0.390 (9.91) 0.635 (16.13) 0.625 (15.87) 0.415 (10.54) max. 0.370 (9.40) 0.360 (9.14) pin 1 pin 3 0.028 (0.70) 0.104 (2.65) 0.096 (2.45) 0.035 (0.90) 0.205 (5.20) 0.195 (4.95) 0.105 (2.67) 0.095 (2.41) features ?plastic package has underwriters laboratory flammability classification 94v-0 ?ideally suited for free wheeling diode, power factor correction applications soft recovery characteristics excellent high temperature switching optimized to reduce switching losses ?glass passivated chip junction mechanical data case: jedec to-220ab, ito-220ab & to-263ab mold- ed plastic body terminals: plated leads, solderable per mil-std-750, method 2026 high temperature soldering guaranteed: 250?/10 sec. at terminals polarity: as marked mounting position: any mounting torque: 10 in-lbs maximum weight: 0.08 oz., 2.24 g
ug18ct, ugf18ct, ugb18ct series vishay semiconductors formerly general semiconductor www.vishay.com document number 88759 2 30-jul-02 maximum ratings (t c = 25? unless otherwise noted) parameter symbol ug18act ug18bct UG18CCT ug18dct unit maximum repetitive peak reverse voltage v rrm 50 100 150 200 v maximum rms voltage v rms 35 70 105 140 v maximum dc blocking voltage v dc 50 100 150 200 v maximum average forward rectified current at t c = 105? i f(av) 18 a peak forward surge current 8.3ms single half sine-wave superimposed i fsm 175 a on rated load (jedec method) per leg operating junction and storage temperature range t j , t stg ?5 to +150 ? rms isolation voltage (ugf) from terminals to 4500 (1) heatsink with t = 1.0 second, rh 30% v isol 3500 (2) v 1500 (3) electrical characteristics ratings at 25? ambient temperature unless otherwise specified. parameter symbol ug18act ug18bct UG18CCT ug18dct unit maximum instantaneous forward voltage per leg (4) at 9.0a 1.1 20a v f 1.2 v 5.0a,t j =100? 0.95 maximum dc reverse current t a = 25? i r 10 a at rated dc blocking voltage per leg t a = 100? 300 maximum reverse recovery time per leg at t rr 20 ns i f = 0.5a, i r = 1.0a, i rr = 0.25a maximum reverse recovery time per leg at t j = 25? t rr 30 ns i f = 9.0a, v r = 30v, di/dt = 50a/?, i rr = 10% i rm t j = 100? 50 maximum stored charge per leg t j = 25? q rr 20 nc i f = 9.0a, v r = 30v, di/dt = 50a/?, i rr = 10% i rm t j = 100? 45 typical junction capacitance per leg at 4.0v, 1mhz c j 30 pf thermal characteristics (t c = 25? unless otherwise noted) parameter symbol ug18 ugf18 ugb18 unit typical thermal resistance from junction to case per leg r jc 4.0 6.0 4.0 ?/w notes: (1) clip mounting (on case), where lead does not overlap heatsink with 0.110 offset (2) clip mounting (on case), where leads do overlap heatsink (3) screw mounting with 4-40 screw, where washer diameter is 4.9mm (0.19? (4) pulse test: 300? pulse width, 1% duty cycle
ug18ct, ugf18ct, ugb18ct series vishay semiconductors formerly general semiconductor document number 88759 www.vishay.com 30-jul-02 3 ratings and characteristic curves (t a = 25? unless otherwise noted) 0 25 50 75 100 125 150 175 0 4.0 8.0 12 16 20 24 1 10 100 10 100 1,000 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.01 0.1 1 10 100 0.1 1 10 100 1 10 100 0 25 50 75 100 125 150 175 0 10 20 30 40 50 60 0 20 40 60 80 100 0.01 0.1 1 10 100 1,000 fig. 2 ?maximum non-repetitive peak forward surge current per leg peak forward surge current (a) number of cycles at 60 h z fig. 1 ?forward current derating curve average forward current (a) case temperature ( c) instantaneous forward voltage (v) fig. 3 ?typical instantaneous forward characteristics per leg fig. 4 ?typical reverse leakage characteristics per leg instantaneous reverse leakage current ( a) percent of rated peak reverse voltage (%) resistive or inductive load instantaneous forward current (a) junction temperature ( c) stored charge / reverse recovery time (nc/ns) fig. 5 ?reverse switching characteristics per leg reverse voltage (v) junction capacitance (pf) fig. 6 ?typical junction capacitance per leg 8.3ms single half sine-wave (jedec method) t c = 105 c t j = 25 c pulse width = 300 s 1% duty cycle t j = 125 c f = 1.0 mhz vsig = 50mvp-p t j = 25 c t j = 125 c t j = 100 c 150a/ s 100a/ s 20a/ s 20a/ s 50a/ s 100a/ s 150a/ s 50a/ s di/dt = i f = 9.0a v r = 30v t rr q rr
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